Title:
PASTY POLYMERIZABLE COMPOSITION AND HIGHLY THERMOCONDUCTIVE MATERIAL
Document Type and Number:
Japanese Patent JP2022049009
Kind Code:
A
Abstract:
To provide a pasty polymerizable composition that exhibits excellent conductivity and heat radiation and has improved adhesion to a semiconductor element or a substrate.SOLUTION: The inventive pasty polymerizable composition contains (A) a compound represented by general formula (a) and (B) silver-containing particles. (In the general formula (a), R1, R2, R3 and R4 independently represent a hydrogen atom, or a substituted or unsubstituted, C1-12 organic group optionally having a heteroatom, where at least one of R1, R2, R3 and R4 is the organic group; and n is 0, 1 or 2).SELECTED DRAWING: None
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Inventors:
KASHINO TOMOMASA
HAMASHIMA AZUMI
HAMASHIMA AZUMI
Application Number:
JP2021149218A
Publication Date:
March 28, 2022
Filing Date:
September 14, 2021
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08G61/06; C08L65/00; C09J11/04; C09J11/06; C09J145/00; H01B1/00; H01B1/22; H01L21/52
Attorney, Agent or Firm:
Shinji Hayami