Title:
PATTERN ETCHING METHOD
Document Type and Number:
Japanese Patent JPH06252530
Kind Code:
A
Abstract:
PURPOSE: To provide a uniform pattern etching method for a copper sheet formed on a multilayer printed circuit board. CONSTITUTION: Uniformity is improved by adding the alkyltrimethyl ammonium chloride of alkyl chain whose number of carbons is 6-20 by an amount sufficient for giving intermediate power behavior to standard copper etching solution. It is especially in the case where an alkyl group is dodecyl, hexadecyl or octadecyl and it is added by 0.01-1.0 wt.%. Silicon antifoaming agent it added for preventing foaming during etching. When such method is used, etching speed is mass transportation controlled at low speed but it becomes almost independent of mass transportation for suppressing surface reaction speed at high speed. Thus, the non-uniformity of etching speed based on the fluctuation of the mass transportation condition of a processor is eliminated. Consequently, the yield improves and the processing of an acculate line multilayer circuit board is realized by the peculiar method.
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Inventors:
SADARUSHIYAN RARU
KUREIGU GOODON SUMISU
KUREIGU GOODON SUMISU
Application Number:
JP16184692A
Publication Date:
September 09, 1994
Filing Date:
May 29, 1992
Export Citation:
Assignee:
AMERICAN TELEPHONE & TELEGRAPH
International Classes:
C23F1/18; H05K3/06; C23F1/00; (IPC1-7): H05K3/06; C23F1/00; C23F1/18
Domestic Patent References:
| JP43012254A | ||||
| JPH0246672A | 1990-02-16 | |||
| JPS59127692A | 1984-07-23 | |||
| JPS60203689A | 1985-10-15 | |||
| JPS61130389A | 1986-06-18 | |||
| JPH0325995A | 1991-02-04 |
Attorney, Agent or Firm:
Hirofumi Mimata
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