Title:
PATTERN-FORMATION METHOD
Document Type and Number:
Japanese Patent JP2018109763
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To find particular applicability in manufacture of a semiconductor device.SOLUTION: A Pattern-formation method comprises the steps of: (a) providing a substrate; (b) forming a photoresist pattern over the substrate; (c) applying a pattern treatment composition to the photoresist pattern, the pattern treatment composition comprising a solvent mixture comprising first organic solvent and second organic solvent, where the first organic solvent has a boiling point that is higher than a boiling point of the second organic solvent, and where the first organic solvent has a boiling point of 210°C or higher; and (d) thereafter heating the photoresist pattern.SELECTED DRAWING: None
Inventors:
KEVIN ROWELL
LIU CONG
XU CHENG BAI
IRVINDER KAUR
HOU XISEN
LI MINGQI
LIU CONG
XU CHENG BAI
IRVINDER KAUR
HOU XISEN
LI MINGQI
Application Number:
JP2017247190A
Publication Date:
July 12, 2018
Filing Date:
December 25, 2017
Export Citation:
Assignee:
ROHM & HAAS ELECT MAT
International Classes:
G03F7/40
Domestic Patent References:
| JP2015127796A | 2015-07-09 | |||
| JP2008107788A | 2008-05-08 | |||
| JP2015187633A | 2015-10-29 | |||
| JP2017219763A | 2017-12-14 | |||
| JP2016128902A | 2016-07-14 | |||
| JP2016006493A | 2016-01-14 | |||
| JP2004087900A | 2004-03-18 |
Foreign References:
| US20110275020A1 | 2011-11-10 |
Attorney, Agent or Firm:
Patent Business Corporation Sender International Patent Office