Title:
PATTERN FORMATION
Document Type and Number:
Japanese Patent JPH11204393
Kind Code:
A
Abstract:
To enable accurate alignment without being affected by comatic aberration.
A plurality of marks 42, 43 for measuring exposure distortion are formed on a sample by the use of an optical reduction projection aligner. The pattern of the marks is approximately identical to an actual element pattern formed by the aligner. Positions of the marks 42, 43 are measured, and the amount of exposure distortion due to the optical reduction projection aligner is obtained in advance. When photomask 41 is formed, the obtained exposure distortion is corrected, and a fine pattern is formed by the sue of the mask 41.
Inventors:
HASEGAWA NORIO
ASAI NAOKO
HAYANO KATSUYA
ASAI NAOKO
HAYANO KATSUYA
Application Number:
JP132298A
Publication Date:
July 30, 1999
Filing Date:
January 07, 1998
Export Citation:
Assignee:
HITACHI LTD
International Classes:
G03F9/00; H01L21/027; (IPC1-7): H01L21/027; G03F9/00
Attorney, Agent or Firm:
Ogawa Katsuo
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