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Patent Searching and Data


Title:
PATTERN FORMING MATERIAL AND PATTERN FORMATION
Document Type and Number:
Japanese Patent JPH01201337
Kind Code:
A
Abstract:

PURPOSE: To obtain the title material having a high sensitivity and a high resolution to an actinic radiation and used in the production of semiconductor elements, magnetic bubble elements, etc., by adding a specified o-naphthoquinone compound to a specified silicone resin.

CONSTITUTION: This pattern forming material is obtained by adding an o- naphthoquinone compound of formula V (wherein Z is OH, OCl, OF, formula VI, formula VII, formula VIII, formula IX or the like, and x and y are positive numbers) to a silicone resin of formula I or II {wherein X is formula III, formula IV [wherein R is a (substituted)hydrocarbon group] or COOH, R'WR'''' are each OH, an alkyl or a phenyl, l, m and n are each 0 or positive integer provided that l and m must not be 0 at the same time, and p is a positive integer}. This material can form a negative pattern of a high sensitivity and a high resolution by irradiating it with an actinic radiation such as ultraviolet rays in a vacuum, an inert gas or air and optionally heating it, irradiating the entire surface with light and developing it with an alkali.


Inventors:
BAN KOJI
TANAKA HARUYORI
Application Number:
JP2563988A
Publication Date:
August 14, 1989
Filing Date:
February 08, 1988
Export Citation:
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Assignee:
NIPPON TELEGRAPH & TELEPHONE
International Classes:
G03F7/38; C08G77/16; C08G77/22; C08K5/08; C08L83/04; G03F7/022; G03F7/038; G03F7/075; G03F7/20; (IPC1-7): C08G77/16; C08K5/08; C08L83/04; G03C1/71; G03C5/00; G03C5/08
Domestic Patent References:
JPS62220949A1987-09-29
Attorney, Agent or Firm:
Hiroshi Nakamoto (2 outside)