PATTERNABLE LOW DIELECTRIC CONSTANT MATERIAL AND ITS USE IN ULSI INTERCONNECTION - INTERNATIONAL BUSINESS MASCHINES CORPORATION

Title:

PATTERNABLE LOW DIELECTRIC CONSTANT MATERIAL AND ITS USE IN ULSI INTERCONNECTION

Document Type and Number:

Japanese Patent JP3935874

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a dielectric material having a low dielectric constant (low k) and not requiring a number of mask layers or processing steps as a dielectric material used for an interconnection structure of integrated circuits.
SOLUTION: A composition containing a functionalized polymer having one or more acid-sensitive groups capable of imaging is provided. The polymer is a low k polymer or a polymer convertible to a low k polymer after succeeding processing with heat or light. Specifically, the polymer may be hydrocarbon, fluorinated hydrocarbon, organosilicate or silsesquioxane.

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Inventors:

Kinhan Lin
Ratnam Suryakumaran

Application Number:

JP2003421691A

Publication Date:

June 27, 2007

Filing Date:

December 18, 2003

Export Citation:

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Assignee:

INTERNATIONAL BUSINESS MASCHINES CORPORATION

International Classes:

G03F7/075; C08G77/04; C08G77/14; C08G77/24; C08K5/00; C08L83/06; C09D183/08; G03F7/004; G03F7/038; H01L21/312; H01L21/316; H01L21/3205; H01L21/768; H01L23/522; H01L23/532; (IPC1-7): G03F7/075; C08G77/14; C08K5/00; C08L83/06; H01L21/312; H01L21/3205; H01L21/768

Domestic Patent References:

JP2000281790A
JP10268520A
JP10186669A
JP9087391A
JP8220765A
JP8160623A
JP8160620A
JP8029987A
JP6184311A
JP6118651A
JP5100431A
JP2002107937A
JP8160621A
JP4159553A
JP8160605A
JP2000298352A
JP2000221687A
JP2002268227A
JP2002110788A
JP2004212946A

Foreign References:

US6162838
US6143643
US5895263
EP1249846A1

Attorney, Agent or Firm:

Hiroshi Sakaguchi
Yoshihiro City
Takeshi Ueno

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