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Title:
Pb FREE SOLDER ALLOY MAKING Zn PRINCIPAL INGREDIENT AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2012228729
Kind Code:
A
Abstract:

To provide a solder alloy for a high temperature which has a melting point of about 300°C-400°C suitable to be used by an assembly or the like of an electronic part, is excellent in wettability, bondability, processability, and reliability, does not contain Pb, and makes Zn a principal ingredient.

The Pb free solder alloy making Zn a principal ingredient includes: 0.01-9.0 mass% of Al; at least one of Ge, Mg, Ag, and P in ranges of 0.01-8.0 mass% of Ge, 0.01-5.0 mass% of Mg, 0.1-4.0 mass% of Ag, and at most 0.5 mass% of P; and a remainder of Zn and inevitable impurities, and is characterized in that an oxide layer of an alloy surface is at most 120 nm, and a surface roughness Ra is at most 0.60 μm.


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Inventors:
IZEKI TAKASHI
TAKAMORI MASAHITO
YAMAGUCHI KOICHI
Application Number:
JP2011100199A
Publication Date:
November 22, 2012
Filing Date:
April 27, 2011
Export Citation:
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Assignee:
SUMITOMO METAL MINING CO
International Classes:
B23K35/28; C22C18/00; C22C18/04
Domestic Patent References:
JP2010036234A2010-02-18
JP2007275921A2007-10-25
JP2009125753A2009-06-11
JP2001150182A2001-06-05
JPH0446695A1992-02-17
JPH11288955A1999-10-19
JP2004358540A2004-12-24
JPS5432063A1979-03-09
JP2002307188A2002-10-22
JP2010064296A2010-03-25
JP2010069748A2010-04-02
JP2010036234A2010-02-18
Attorney, Agent or Firm:
Yoshitaka Oshida



 
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