Title:
PEELING METHOD AND PEELING DEVICE
Document Type and Number:
Japanese Patent JP2017034015
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a peeling method and a peeling device which allow for peeling a protective tape (sheet) pasted to a semiconductor wafer (plate-like member), without using any complicated configuration, or a peeling tape with a large burden of running cost.SOLUTION: A peeling method is constituted of at least a first peeling step of hitting the tip of a needle-like member against at least a part of the outer periphery of a plate-like member sheet held on a holding table, and peeling the part from the plate-like member, a peeling start point generation step of blowing air between the sheet peeled partially and the plate-like member, and generating a peeling start point formed by the enlarged peeling region including the part, and a final peeling step of peeling the residual part of the sheet not yet peeled, from the plate-like member, starting from the peeling start point. A peeling device capable of executing the peeling method is also provided.SELECTED DRAWING: Figure 1
Inventors:
TAKAZAWA TORU
Application Number:
JP2015150397A
Publication Date:
February 09, 2017
Filing Date:
July 30, 2015
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/683; H01L21/304
Domestic Patent References:
| JPH09309664A | 1997-12-02 | |||
| JP2009295757A | 2009-12-17 | |||
| JP2010206088A | 2010-09-16 | |||
| JP2012224469A | 2012-11-15 | |||
| JPH1116862A | 1999-01-22 | |||
| JP2003338477A | 2003-11-28 |
Foreign References:
| US20070261783A1 | 2007-11-15 |
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Kojino Koji
Sachiko Okunuki
Kojino Koji
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