Title:
フェノール樹脂発泡体及びその製造方法
Document Type and Number:
Japanese Patent JP6527963
Kind Code:
B2
Abstract:
A phenolic resin foam that has low initial thermal conductivity, maintains low thermal conductivity over the long term, and has excellent compressive strength is provided. A phenolic resin foam comprises: cyclopentane; and a high-boiling hydrocarbon with a boiling point of 140 °C or more and 350 °C or less, and has a density of 10 kg/m 3 or more and 150 kg/m 3 or less. The content of the cyclopentane in the phenolic resin foam is 0.25 mol to 0.85 mol per a space volume of 22.4 × 10 -3 m 3 in the phenolic resin foam.
Inventors:
Shigemi Mukaiyama
Application Number:
JP2017558228A
Publication Date:
June 12, 2019
Filing Date:
December 21, 2016
Export Citation:
Assignee:
Asahi Kasei Building Materials Co., Ltd.
International Classes:
C08J9/14; C08G14/08
Domestic Patent References:
| JP11140216A | ||||
| JP2015187249A |
Foreign References:
| WO2015194174A1 | ||||
| WO1999011697A1 | ||||
| WO2014092086A1 |
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Koichiro God
Tsubouchi Shin
Mitsutsugu Sugimura
Koichiro God
Tsubouchi Shin