Title:
縮合環式有機化合物を含有するフェノール性水酸基含有ポリアミド樹脂組成物
Document Type and Number:
Japanese Patent JP6834443
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a phenolic hydroxy group-containing polyamide resin having excellent solvent solubility and high gas barrier properties at a high humidity, and a resin composition comprising the same.SOLUTION: A phenolic hydroxy group-containing polyamide resin composition comprises a phenolic hydroxy group-containing polyamide resin (A) that comprises an aromatic diamine (b) unit of 20 mol% or more with a phenolic hydroxyl group content of 500-6,000 eq/t, and a condensed cyclic organic compound (B).SELECTED DRAWING: None
Inventors:
Naoko Oda
Hideki Tanaka
Hideki Tanaka
Application Number:
JP2016242226A
Publication Date:
February 24, 2021
Filing Date:
December 14, 2016
Export Citation:
Assignee:
Toyobo Co., Ltd.
International Classes:
C08L77/06; B32B27/34; B65D65/40; C08G69/26; C08K5/3462
Domestic Patent References:
| JP2007246668A | ||||
| JP9176485A | ||||
| JP10330480A | ||||
| JP9031154A | ||||
| JP2008138191A | ||||
| JP2007204598A |
Foreign References:
| WO2011114665A1 |