Title:
PHENOLIC RESIN MOLDING MATERIAL FOR COMMUTATOR
Document Type and Number:
Japanese Patent JP2006117815
Kind Code:
A
Abstract:
To provide a phenolic resin molding material for a commutator, having excellent mold releasability and moldability without deteriorating the characteristic mechanical strengths, dimensional stability and heat-resistance of phenolic resin molding materials.
This phenolic resin molding material for the commutator contains a resol-type phenolic resin and an inorganic filler as essential components and further contains an elastomer comprising acrylonitrile-butadiene rubber and/or polyvinyl acetal and a mold release agent comprising a partially saponified ester wax.
Inventors:
NISHIMURA MASAO
Application Number:
JP2004307651A
Publication Date:
May 11, 2006
Filing Date:
October 22, 2004
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L61/10; C08K3/00; C08L9/02; C08L29/14; C08L91/06