THERMOPLASTIC RESIN COMPOSITION, ITS MOLDED ARTICLE AND METHOD FOR PRODUCING THE SAME

Japanese Patent JP2006117814

A

To provide a thermoplastic resin composition easily injection-moldable to form a heat-dissipation member and a case of a heat-generating electronic part and having excellent rigidity, impact strength, heat-resistance and heat-dissipation property and provide a molded article of the composition and method for producing the molded article.

The thermoplastic resin composition is composed of a thermoplastic resin and a specific filler and has a thermal conductivity of 0.4-1.5 W/mK, a melt mass flow rate of 2-200 g/10min and a flexural modulus of 1,000-8,000 Mpa. The invention further provides a molded article of the composition and a method for forming the molded article.

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SHIMIZU KOICHI
TSUKADA MASAFUMI
TAKAHASHI ATSUSHI

JP2004307590A

May 11, 2006

October 22, 2004

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DENKI KAGAKU KOGYO KK

C08L101/00; C08J5/00; C08K7/18; C09K5/08; H01L23/373; H05K7/20

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