To provide a photocrosslinkable resin which has photocrosslinkability and reproduces a phenol novolac resin upon heating, and to provide a photosensitive resin composition obtained by combining such a photocrosslinkable resin with an epoxy resin, which is capable of forming a pattern upon irradiation with light so that, when the pattern is heated, the epoxy resin can be cured.

The photocrosslinkable resin comprises a modified phenol novolac resin obtained by reacting a phenolic hydroxyl group of a phenol novolac resin with a vinyl ether group of a (meth)acrylate derivative represented by general formula (I), wherein R1 denotes a hydrogen atom or a methyl group; R2 and R3 each independently denote a 2-4C alkylene group; and n is 0 or an integer of 1-20.