Title:
PHOTORESIST SPRAY DEVICE
Document Type and Number:
Japanese Patent JP3934194
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a photoresist spray device which prevents bubbles from being contained in applied photoresist by a method wherein the photoresist spray device is equipped with a tank which is filled with photoresist, and photoresist is supplied through the tank.
SOLUTION: When a valve 145 is opened, nitrogen gas is made to flow through the gas inlet pipe 141 of a gas pipe 140. Thereafter, when nitrogen gas is discharged out through a gas exhaust vent 142, air inside the tank 110 is also discharged out through the gas exhaust vent 142. By this setup, the tank 110 is reduced in inner pressure, and photoresist is made to flow into the tank 110 from outside. The valve 145 is closed, nitrogen gas which is injected through the gas inlet pipe 141 of the gas pipe 140 is made to flow into the tank 110, and photoresist 115 inside the tank 110 is sprayed onto a semiconductor wafer through the photoresist exhaust vent 156 of a photoresist exhaust pipe 155.
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Inventors:
Lee Li Ming
Zhang Yin Jin
Zhang Yin Jin
Application Number:
JP2779197A
Publication Date:
June 20, 2007
Filing Date:
February 12, 1997
Export Citation:
Assignee:
Samsung Electronics Co.,Ltd.
International Classes:
H01L21/027; B05B9/04; G03F7/16; H01L21/312; (IPC1-7): H01L21/027
Domestic Patent References:
| JP4074414A | ||||
| JP62144327A | ||||
| JP62037923U | ||||
| JP3116818A | ||||
| JP4197434A | ||||
| JP5304087A | ||||
| JP8250412A |
Attorney, Agent or Firm:
Mikio Hatta
Atsushi Nogami
Atsushi Nogami
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