Title:
PHOTOSENSITIVE COMPOSITE MATERIAL SHEET, RESIN FIBER COMPOSITE FILM, AND HEAT DISSIPATION/HEAT TRANSFER CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2018132655
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thin circuit board in which an insulating layer and a wiring layer are formed in the same layer and are integrated with each other, and a heat dissipation part and a heat insulation part coexist as heat dissipation circuits, and to provide a thin wiring board in which the insulating layer and the wiring layer are formed in the same layer inside of a low CTE substrate and are integrated with each other.SOLUTION: A photosensitive composite material containing photosensitive resin and a photosensitive agent in a cellulose porous sheet satisfies the following conditions: 1. air impermeability of the cellulose porous sheet is 1 s/100 ml or more and 400,000 s/100 ml or less; 2. the photosensitive resin contains at least one of a polymerizable compound, alkali soluble resin and resin in which a photofunctional group of the alkali soluble resin is protected with a protective group; and 3. light transmittance at a wavelength of 280 nm to 433 nm when a photosensitive composite material sheet has a thickness of 50 μm is 10% or more.SELECTED DRAWING: None
Inventors:
ONO HIROBUMI
SAITO YAMATO
MATSUIDE DAISUKE
YAMAMOTO MASAKI
SAITO YAMATO
MATSUIDE DAISUKE
YAMAMOTO MASAKI
Application Number:
JP2017026180A
Publication Date:
August 23, 2018
Filing Date:
February 15, 2017
Export Citation:
Assignee:
ASAHI KASEI CORP
International Classes:
G03F7/09; D21H11/18; D21H13/20; G03F7/023; G03F7/028; H05K1/03; H05K3/46
Foreign References:
| WO2016047764A1 | 2016-03-31 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Kazuhiro Nakamura
Hideo Katsumata
Shunsuke Mima
Toko Saito
Takashi Ishida
Tetsuji Koga
Kazuhiro Nakamura
Hideo Katsumata
Shunsuke Mima
Toko Saito