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Title:
PHOTOSENSITIVE COMPOSITION FOR METAL OR METAL OXIDE ETCHING
Document Type and Number:
Japanese Patent JP2002202600
Kind Code:
A
Abstract:

To provide a photosensitive composition for metal or metal oxide etching excellent in resolution and etching resistance as a resist and ensuring enhanced product quality.

The photosensitive composition is applied to an object, at least the surface of which comprises a metal or metal oxide to be etched, and the composition is patternwise exposed with active energy beams and developed with a water-base developer to form a mask for etching, which can be removed with an alkali solution after the metal or metal oxide is etched. The composition contains A) a water-soluble photopolymerizable polymer containing constitutional units of formulae (I)-(III) (where X is one or more selected from H, an alkali metal and ammonium), B) at least one of a photopolymerization initiator and a photosensitizer and C) water as essential components.


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Inventors:
UTSUNOMIYA SHIN
YAMADA SEIGO
Application Number:
JP2000399250A
Publication Date:
July 19, 2002
Filing Date:
December 27, 2000
Export Citation:
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Assignee:
TOYO GOSEI KOGYO KK
International Classes:
G03F7/038; C08F290/12; C08F299/00; G03F7/40; H05K3/06; (IPC1-7): G03F7/038; C08F290/12; C08F299/00; G03F7/40; H05K3/06
Attorney, Agent or Firm:
Hiroyuki Kurihara