Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PHOTOSENSITIVE COMPOSITION, PATTERN FORMING MATERIAL, PHOTOSENSITIVE LAMINATE, PATTERN FORMING APPARATUS, AND PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JP2007079120
Kind Code:
A
Abstract:

To provide a photosensitive composition for forming a high-definition pattern by having high sensitivity, excellent resolution and very high time passage stability of sensitivity, and to provide a pattern forming material having a photosensitive layer formed by the photosensitive composition, a photosensitive laminate, a pattern forming apparatus, and a pattern forming method.

The photosensitive composition includes at least a binder and a polymerization compound, a photopolymerization initiator based compound, and a polymerization inhibitor. The photosensitive composition contains a compound having, as the photopolymerizasion initiator compound, di-substitution amino benzene as a partial structure. The pattern forming material having the photosensitive layer formed by the photosensitive composition, the photosensitive laminate, the pattern forming apparatus with the photosensitive laminate, and the pattern forming method are provided.


Inventors:
TAKASHIMA MASANOBU
IKEDA TAKAMI
Application Number:
JP2005266758A
Publication Date:
March 29, 2007
Filing Date:
September 14, 2005
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJIFILM CORP
International Classes:
G03F7/004; C08F299/00; G03F7/031; G03F7/033; G03F7/20; H05K3/00; H05K3/28; H05K3/46
Attorney, Agent or Firm:
Koichi Hirota
Yoshihiro Nagare
Naoko Matsuda