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Title:
感光性組成物、透明硬化膜、積層体、及び積層体の製造方法
Document Type and Number:
Japanese Patent JP7428365
Kind Code:
B2
Abstract:
To provide a photosensitive composition which can achieve high resolution and excellent curability while having high transparency.SOLUTION: A photosensitive composition contains a photosensitive resin (A), a photopolymerization initiator (B) and a photopolymerizable compound (C). The photosensitive resin (A) contains a photosensitive resin (A1) which is produced by reaction of a product produced by reaction of an epoxy compound (a1) having at least two epoxy groups and carboxylic acid (a2) having an ethylenically unsaturated group, and acid anhydride (a3) containing acid dianhydride (a4). When a dry film having a thickness dimension of 10 μm is prepared from the photosensitive composition, light transmittance at a wavelength of 450-800 nm is 85% or more, a maximum value of absorbance in a wavelength region of 250-800 nm of the dry film is in a wavelength region of 300-330 nm, and a maximum value of the absorbance is 1 or larger.SELECTED DRAWING: Figure 1

Inventors:
Tomoya Higuchi
Sota Nishimura
Souichi Hashimoto
Takashi Arai
Application Number:
JP2019189330A
Publication Date:
February 06, 2024
Filing Date:
October 16, 2019
Export Citation:
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Assignee:
Mutual Chemical Industry Co., Ltd.
International Classes:
G03F7/027; B32B3/14; B32B27/38; C08G63/133; G03F7/004; G03F7/029; G03F7/031; G03F7/20
Domestic Patent References:
JP2017088842A
Foreign References:
WO2016121394A1
WO2015093415A1
Attorney, Agent or Firm:
Hokuto Patent Attorneys Office