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Title:
PHOTOSENSITIVE DRY FILM AND PROCESS FOR PRODUCING PRINTED WIRING BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2016027363
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive dry film capable of forming a solder resist layer that has an excellent filling property of underfill and that exhibits an excellent adhesion to a mold material.MEANS: The photosensitive dry film according to the present invention is a photosensitive dry film including a supporting film and a photosensitive resin layer provided on one side of the supporting film. An arithmetic average surface roughness Ra on the side of the supporting film on which the photosensitive resin layer is provided is 50 to 390 nm.SELECTED DRAWING: Figure 1

Inventors:
OKAMOTO DAICHI
ITO NOBUHITO
MINEGISHI MASASHI
Application Number:
JP2015025558A
Publication Date:
February 18, 2016
Filing Date:
February 12, 2015
Export Citation:
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Assignee:
TAIYO INK MFG CO LTD
International Classes:
G03F7/09; G03F7/004; H05K3/28
Domestic Patent References:
JP2015043406A2015-03-05
JP2012129526A2012-07-05
JP2015023184A2015-02-02
JP2009223142A2009-10-01
JP2007178500A2007-07-12
JP2012093559A2012-05-17
JP2015043406A2015-03-05
JP2012129526A2012-07-05
JP2015023184A2015-02-02
Foreign References:
WO2006059534A12006-06-08
WO2007004657A12007-01-11
Attorney, Agent or Firm:
Hirohito Katsunuma
Yukitaka Nakamura
Mari Asano
Hiroshi Sorimachi



 
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