Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT OBTAINED BY CURING THE SAME, BLACK MATRIX, AND IMAGE DISPLAY DEVICE
Document Type and Number:
Japanese Patent JP2015084086
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which has high sensitivity and is easily photo-cured even when the composition has a high concentration of a coloring material, which shows good curability of a surface, which can produce a highly fine line having high adhesion in a developing process with good reproducibility, and which has good adhesiveness to a sealing agent or a substrate.SOLUTION: The photosensitive resin composition comprises an alkali-soluble resin having an ethylenically unsaturated group, a photopolymerizable monomer, a photopolymerization initiator, a coloring material, and a dispersant. The photopolymerization initiator comprises a photopolymerization initiator expressed by formula (1).
Inventors:
MIYAZAKI TAKAHIRO
MATSUNAGA EIJI
KAMIMURA JIRO
MATSUNAGA EIJI
KAMIMURA JIRO
Application Number:
JP2014171715A
Publication Date:
April 30, 2015
Filing Date:
August 26, 2014
Export Citation:
Assignee:
MITSUBISHI CHEM CORP
International Classes:
G03F7/031; C08F2/44; C08F2/50; C08F265/00; G02B5/20; G03F7/004; G03F7/038
Domestic Patent References:
| JP2011253174A | 2011-12-15 | |||
| JP2016509099A | 2016-03-24 | |||
| JP2013065000A | 2013-04-11 | |||
| JP2009086563A | 2009-04-23 | |||
| JP2012113104A | 2012-06-14 | |||
| JP2008233605A | 2008-10-02 | |||
| JP2016527329A | 2016-09-08 |
Foreign References:
| CN103309154A | 2013-09-18 | |||
| US20130188270A1 | 2013-07-25 | |||
| WO2013129403A1 | 2013-09-06 | |||
| CN102020727A | 2011-04-20 |
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