感光性樹脂組成物、電子デバイスの製造方法および電子デバイス

Title:

感光性樹脂組成物、電子デバイスの製造方法および電子デバイス

Document Type and Number:

Japanese Patent JP7392580

Kind Code:

B2

Abstract:

To provide a photosensitive resin composition which is formed into a cured film by being heated at approximately 170°C thereby being cured, so that a highly reliable electronic device can be manufactured.SOLUTION: A photosensitive resin composition including a polyamide resin and/or a polyimide resin is provided in which when a cured film obtained by heating the photosensitive resin composition at 170°C for 2 hours is subjected to dynamic viscoelasticity measurement on the following condition, a storage elastic modulus E'220 at 220°C is 0.5 to 3.0 GPa. [Condition] Frequency: 1 Hz, temperature: 30-300°C, rate of temperature rise of 5°C/min, and measurement mode: tensile mode.SELECTED DRAWING: Figure 1

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Inventors:

Takushi Kawanami
Yuma Tanaka
Ritsuya Kawasaki

Application Number:

JP2020099148A

Publication Date:

December 06, 2023

Filing Date:

June 08, 2020

Export Citation:

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Assignee:

Sumitomo Bakelite Co., Ltd.

International Classes:

G03F7/037; C08F2/44; C08F283/04; C08G59/50; G03F7/004; G03F7/027; G03F7/20

Domestic Patent References:

JP2016148767A
JP2019053220A

Foreign References:

WO2018159384A1

Attorney, Agent or Firm:

Shinji Hayami

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