To provide a photosensitive resin composition of alkaline developing type for forming a halogen-free coating having high-level flame retardancy, excellent in plasticity, resolution, soldering heat resistance, adhesiveness, chemical resistance, or the like; and a flexible printed wiring board using the same.

The photosensitive resin composition of alkaline developing type includes (A) a resin component that has a (meth)acryloyl group and a carboxyl group in one molecule and is soluble in dilute alkali solution; (B) a heat-curable component having an epoxy group; (C) a heat resistant aluminum hydroxide; (D) a phosphorous-based flame retardant; (E) a photopolymerization initiator; and (F) a diluent, and is not inferior in characteristics to conventional photosensitive resin compositions using a brominated epoxy resin and a halogen-based flame retardant, has excellent characteristics, and has such excellent properties that problematic hydrogen bromide is not generated in combustion. The flexible printed wiring board using the composition is also provided.