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Title:
PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE, AND ELECTROMAGNETIC WAVE SHIELD AND TRANSPARENT CONDUCTIVE SUBSTRATE USING THE SAME
Document Type and Number:
Japanese Patent JP2011048064
Kind Code:
A
Abstract:

To provide a photosensitive resin laminate which is used to form a resist pattern having good solvent resistance by low-temperature curing, and which is very excellent in storage stability.

A photosensitive resin composition is provided including: (a) 10-90 mass% of an alkali-soluble binder resin; (b) 5-50 mass% of a photosensitive compound having an ethylenically unsaturated double bond; (c) 0.01-20 mass% of a photoradical polymerization initiator; (d) 0.1-20 mass% of a radical polymerization inhibitor; (e) 0.05-20 mass% of a photoacid generator; and (f) 1-40 mass% of an oxetane compound, wherein the photoacid generator (e) is nonionic.


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Inventors:
SUZUKI TAKASHI
Application Number:
JP2009195400A
Publication Date:
March 10, 2011
Filing Date:
August 26, 2009
Export Citation:
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Assignee:
ASAHI KASEI E MATERIALS CORP
International Classes:
G03F7/004; G03F7/031; G03F7/40; H05K3/06
Domestic Patent References:
JP2009116316A2009-05-28
JP2010256717A2010-11-11
JP2009003366A2009-01-08
JP2003255531A2003-09-10
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Kazuhiro Nakamura
Hiroyuki Onoda
Toko Saito



 
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