Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2003345006
Kind Code:
A
Abstract:
To provide a photosensitive resin composition having high resolution, high adhesion of thin lines and excellent storage stability of a film and useful to form the electrodes of PDP (plasma display panel).
The photosensitive resin composition comprises a carboxylic polymer (A), a specified carboxylic urethane-acrylic oligomer (B), a photopolymerizable monomer (C) having three or more ethylenically unsaturated groups in one molecule, and a photopolymerization initiator (D).
Inventors:
SHIMIZU TOSHIHIRO
Application Number:
JP2002155066A
Publication Date:
December 03, 2003
Filing Date:
May 29, 2002
Export Citation:
Assignee:
NIPPON SYNTHETIC CHEM IND
International Classes:
G03F7/027; C08F290/06; G03F7/004; G03F7/033; (IPC1-7): G03F7/027; C08F290/06; G03F7/004; G03F7/033
Previous Patent: PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE FILM
Next Patent: PHOTOSENSITIVE POLYMIDE COMPOSITION
Next Patent: PHOTOSENSITIVE POLYMIDE COMPOSITION