Title:
PHOTOSENSITIVE POLYMIDE COMPOSITION
Document Type and Number:
Japanese Patent JP2003345007
Kind Code:
A
Abstract:
To provide a photosensitive polyimide composition having such an administrative advantage as to hardly incur deterioration in quality even in storage at ordinary temperature and not requiring a high temperature treatment for imidation.
The photosensitive polyimide composition comprises a polyimide obtained by the direct imidation reaction of one or more acid dianhydrides with one or more diamines and having a carboxyl group in a side chain and further comprises an aminoacylamide compound (or an aminomethacrylamide compound) as a component reactive with the carboxyl group.
Inventors:
TOMOI MASAO
HONDA YUKI
HOSOKAWA KATSUMOTO
KAMIMURA SEIJI
ANDO YOSHIYUKI
ASANO KENJI
ITO YUZO
HONDA YUKI
HOSOKAWA KATSUMOTO
KAMIMURA SEIJI
ANDO YOSHIYUKI
ASANO KENJI
ITO YUZO
Application Number:
JP2002346890A
Publication Date:
December 03, 2003
Filing Date:
November 29, 2002
Export Citation:
Assignee:
HITACHI CABLE
International Classes:
G03F7/027; C08G73/10; G03F7/075; (IPC1-7): G03F7/027; C08G73/10; G03F7/075
Attorney, Agent or Firm:
Shigeru Kawasumi
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