PHOTOSENSITIVE RESIN COMPOSITION

Japanese Patent JP3969999

B2

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in sensitivity in exposure and resolution of a resist pattern after development, less liable to scum in a developing step, having good plating resistance and useful as alkali-developable DFR (dry film resist) for manufacturing substrates for a printed wiring board, for a lead frame and for a semiconductor package.
SOLUTION: The photosensitive resin composition comprises (a) 20-90 mass% binder resin comprising a linear polymer having a carboxyl content of 100-600 (expressed in terms of acid equivalent) and a weight average molecular weight of 20,000-500,000, (b) 3-70 mass% photopolymerizable unsaturated compound and (c) 0.01-30 mass% photopolymerization initiator of formula (V).

JP2007034153	ENERGY LINE-SENSITIVE POLYMERIZABLE COMPOSITION, NEGATIVE RESIST USING THE SAME AND PICTORIAL PATTERN FORMING METHOD USING THE SAME
WO/2020/090996	LITHOGRAPHIC PRINTING PLATE ORIGINAL PLATE, METHOD FOR PRODUCING LITHOGRAPHIC PRINTING PLATE AND LITHOGRAPHIC PRINTING METHOD
JPH04215661	FORMATION OF RESIST PATTERN

Tsutomu Igarashi
Toru Mori

JP2001343407A

September 05, 2007

November 08, 2001

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Asahi Kasei Electronics Co., Ltd.

G03F7/029; C08F2/44; C08F2/50; C08F290/06; C08F291/00; C08F299/02; G03F7/004; G03F7/027; G03F7/033; H05K3/00; H05K3/06; H05K3/18; (IPC1-7): G03F7/029; C08F2/44; C08F2/50; C08F290/06; C08F291/00; C08F299/02; G03F7/004; G03F7/027; G03F7/033; H05K3/00; H05K3/06; H05K3/18

JP2000206691A
JP7319154A
JP2000321767A
JP2001175000A

Yoshio Narui
Takeshi Shimizu
Joi Ito
Hideo Takei

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