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Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH07104474
Kind Code:
A
Abstract:

PURPOSE: To improve heat resistance, solvent resistance, water resistance or the like by containing annular olefin resin with a silicon compound residue containing a hydrolytic group, and a photo-reactive substance to generate a bridged compound via reaction with the resin.

CONSTITUTION: In annular olefin resin (A) having a hydrolytic silicon group, a photo-reaction substance (B) to generate a bridged compound due to reaction with the resin (A) upon exposure to an activated beam, and a sensitizer and other additives as necessary are evenly dispersed. The (B) component is preferably 1 to 20 pts.wt. for the (A) component. The (A) component is resin having a silicon compound residue containing a hydrolytic group inside a molecular chain, at a side chain or at the end of a chain, and a number average molecular weight is between 5000 and 20000 (GPC analysis value using cyclohexane as solvent). Also, the resin preferably has a silicon content between 0.05 and 10% on the basis of polymer weight. Furthermore, an aromatic bisdiazo compound, optical diamine generating agent or the like can be mentioned as the (B) component.


Inventors:
YUDA HIDEKO
KATAOKA HIDEAKI
SUGIMURA MASAHIKO
MITSUTA YASUHIRO
Application Number:
JP26820593A
Publication Date:
April 21, 1995
Filing Date:
September 30, 1993
Export Citation:
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Assignee:
NIPPON ZEON CO
International Classes:
G03F7/004; C08F2/50; C08G61/06; C08G61/08; C08L43/00; C08L43/04; G03F7/008; G03F7/028; G03F7/038; G03F7/075; H01L21/027; (IPC1-7): G03F7/038; C08F2/50; C08G61/08; C08L43/04; G03F7/004; G03F7/008; G03F7/028; G03F7/075; H01L21/027
Attorney, Agent or Firm:
Eiji Tomomatsu (1 person outside)