To obtain excellent shock resistance, packability and productivity by previously plating a eutectic solder material on the outer circumferential metal part, the inner and the outer lead of a base, supplying and smelting a high-temperature solder paste to the inner lead and connecting it to the electrode of a piezo-electric resonator.
A cap 4 is made of copper nickel alloy such as nickel silver, and its inside face is plated by soft metal such as the eutectic solder material in the thickness of several μm almost the inside of the opening. A soft metal layer of the underside of the cap 4 and a soft metal layer on the surface of the base 1 keep pressure welding airtight when in force-fitting. A low- temperature solder which is plated on the outer circumference metal part 12 and a low-temperature solder which is plated underside the cap 4 are mutually pressure-welded by force-fitting to seal in airtight. At the time of mounting, though the high-temperature solder paste is heated and smelted, the occurrence of a solder ball and solder skip is extremely less comparing with the low- temperature solder. Even if there is droplet, it is immediately cooled and is hardly to stick to the piezo-electric resonator and a container or the like.
| JP4672352 | Solder paste for bump formation |
| WO/2016/031067 | SOLDER MATERIAL, SOLDER JOINT, AND PRODUCTION METHOD FOR SOLDER MATERIAL |
| JP2007075836 | LEAD FREE ALLOY FOR SOLDERING |
TAKAYANAGI HIROAKI
HAYASHI TOSHIYA
WAKABAYASHI HISAO
CITIZEN WATCH CO LTD