Title:
圧電デバイス、および、圧電デバイスの製造方法
Document Type and Number:
Japanese Patent JP5783256
Kind Code:
B2
Abstract:
In a method for manufacturing a piezoelectric device while stably achieving strong bonding, a moisture-absorbing layer is formed on a bonding surface side of a piezoelectric single-crystal substrate. The moisture-absorbing layer is allowed to absorb moisture. A binder layer is formed on a bonding surface side of a supporting substrate. The moisture-absorbing layer is placed on the binder layer. A silica precursor in the binder layer is converted into silica through a hydrolysis reaction with moisture in the moisture-absorbing layer.
Inventors:
Takashi Iwamoto
Application Number:
JP2013531244A
Publication Date:
September 24, 2015
Filing Date:
August 23, 2012
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H03H9/145; H03H3/02; H03H3/08; H03H9/17; H03H9/25
Domestic Patent References:
| JP2001196896A | ||||
| JP2003347612A | ||||
| JP2003017967A |
Foreign References:
| WO2011004665A1 | ||||
| WO2011065317A1 |
Attorney, Agent or Firm:
Kaede International Patent Office