Title:
PIEZOELECTRIC VIBRATION CHIP, PIEZOELECTRIC VIBRATION DEVICE, AND METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATION DEVICE
Document Type and Number:
Japanese Patent JP2011160095
Kind Code:
A
Abstract:
To prevent a CI value which is decreased by annealing from increasing significantly by more heat treatment after annealing when a piezoelectric vibration device is manufactured.
In a piezoelectric vibration chip 1 consisting of a piezoelectric material, excitation electrodes 26 and 27 are formed of the first metal which is bonded to the piezoelectric material, and the second metal which is bonded to the first metal. The second metal has the conductivity higher than that of the first metal, and the weight ratio of the first metal to the second metal is set in the range of 5.9-30.3%.
Inventors:
SAKAMOTO KAZUYASU
Application Number:
JP2010018758A
Publication Date:
August 18, 2011
Filing Date:
January 29, 2010
Export Citation:
Assignee:
DAISHINKU CORP
International Classes:
H03H9/19; H01L41/09; H01L41/18; H01L41/22; H01L41/23; H01L41/253; H01L41/313; H03H3/02; H03H9/02
Domestic Patent References:
| JP2008167171A | 2008-07-17 | |||
| JP2007336320A | 2007-12-27 | |||
| JP2007088542A | 2007-04-05 |
Attorney, Agent or Firm:
Patent Business Corporation Ark Patent Office