Title:
PIPE JOINT, METHOD OF MANUFACTURING THE SAME, AND FLUID DEVICE USING PIPE JOINT
Document Type and Number:
Japanese Patent JP2002144300
Kind Code:
A
Abstract:
To provide a pipe joint having a joint structure capable of joining without using an adhesive, a method of manufacturing the pipe joint, and a fluid device using the pipe joint.
A resin mold 8 for plating, projecting from a surface of the fluid device is formed by packing a resin into openings 6a, 6b, 6c of a lid part 5 of the fluid device such as micro-reactor 1, and hollow projecting parts 7 directly communicated to the openings, 6a, 6b, 6c are integrally formed on a surface side of the lid part 5 by the plating with the resin mold 8. Or a micro- fluid joint manufactured by a similar method is joined to the opening of the fluid device without using the adhesive.
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Inventors:
OGAWA MINORU
Application Number:
JP2001201551A
Publication Date:
May 21, 2002
Filing Date:
July 03, 2001
Export Citation:
Assignee:
TOSHIBA TEC KK
International Classes:
B01J19/00; B01L3/00; B81B1/00; B81C1/00; F16L39/00; F16L41/08; (IPC1-7): B81C1/00; B01J19/00; B81B1/00; F16L39/00; F16L41/08
Attorney, Agent or Firm:
Masashi Kashiwagi (2 others)
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