Title:
PLANER COIL COMPONENT AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2021158135
Kind Code:
A
Abstract:
To suppress a shape change of an insulating layer after improving the heat dissipation of a wiring layer of the planer coil component.SOLUTION: A planer coil component includes a plurality of wiring layers, and a plurality of ceramic layers stacked alternately with the plurality of wiring layers, and for at least one of the plurality of ceramic layers, a first metallized layer is formed on the upper surface in the stacking direction in which the plurality of wiring layers and the plurality of ceramic layers are laminated, and a second metallized layer is formed on the lower surface in the stacking direction so as to be separated from the first metallized layer, and at least one of the first metallized layer and the second metallized layer is joined to the opposite wiring layer.SELECTED DRAWING: Figure 2
Inventors:
YOKOYAMA TAKAHIRO
Application Number:
JP2020054079A
Publication Date:
October 07, 2021
Filing Date:
March 25, 2020
Export Citation:
Assignee:
NGK SPARK PLUG CO
International Classes:
H01F17/00; H01F17/04; H01F41/04; H05K1/16; H05K3/46
Attorney, Agent or Firm:
Junya Tanabe
Itaekura Yukie
Seiji Kizaki
Itaekura Yukie
Seiji Kizaki