PLASMA PROCESSING EQUIPMENT AND METHOD

Japanese Patent JP3726040

B2

PROBLEM TO BE SOLVED: To provide a plasma processing equipment which enables uniform plasma-processing of the surfaces of substrates, having different sizes.
SOLUTION: On the side, from which a substrate 11 is transferred of a line plasma generator 2, a location detector 8 is provided which detects the substrate 11 transferred on a guide susceptor 3 on a transfer stand 4. A high-frequency power controller 10 is also provided, which obtains the width of the substrate 11, corresponding to a location where a line plasma is generated from the time elapsed after the time when the substrate 11 was detected by the location detector 8, a transfer rate of the substrate 11, and the shape of the substrate 11 which is inputted in advance, and then controls the power to be supplied to a line electrode 21 from a high-frequency power supply 5, depending on the width of the substrate 11.

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Kiyotaka Ishibashi
Kugimiya Toshihiro
Takayuki Hirano
Kazushi Hayashi
Hiroshi Goto
Akira Kobayashi
Nakagami Meiko

JP2001196861A

December 14, 2005

June 28, 2001

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KABUSHIKI KAISHA KOBE SEIKO SHO

H05H1/26; B01J19/08; C23C16/505; H01L21/205; H01L21/302; H01L21/3065; H05H1/46; (IPC1-7): H01L21/205; B01J19/08; C23C16/505; H01L21/3065; H05H1/26; H05H1/46

JP2001093871A

Yoshiyuki Kaji
Makoto Suhara

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