Title:
プラズマ処理装置およびプラズマ処理方法
Document Type and Number:
Japanese Patent JP7085963
Kind Code:
B2
Abstract:
In a plasma processing apparatus, a processing chamber is provided. First electrodes are disposed inside the processing chamber and supplied with radio frequency powers. The second electrode is disposed inside the processing chamber and functions as a counter electrode for the first electrodes. The power supply source supplies radio frequency powers to the first electrodes to generate plasma between the first electrodes and the second electrode and process a target object using the plasma. The allocation setting unit is disposed between the power supply source and at least one of the first electrodes to set power allocations of the radio frequency powers to be supplied to the first electrodes. Further, the allocation setting unit has series circuits in each of which an impedance circuit and a switching element are connected in series. The series circuits are connected in parallel. The control device controls the switching elements in the series circuits.
Inventors:
Satoshi Kawakami
Mitsunari Tadashi
Shinya Iwashita
Yusuke Suzuki
Mitsunari Tadashi
Shinya Iwashita
Yusuke Suzuki
Application Number:
JP2018202556A
Publication Date:
June 17, 2022
Filing Date:
October 29, 2018
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
C23C16/52; C23C16/505; H01L21/3065; H01L21/31; H05H1/46
Domestic Patent References:
| JP2004096066A | ||||
| JP2015026475A | ||||
| JP2017228395A |
Attorney, Agent or Firm:
Sakai International Patent Office