Title:
プラズマ処理方法
Document Type and Number:
Japanese Patent JP5695694
Kind Code:
B2
Abstract:
A plasma apparatus (1200) with improved cooling is disclosed. The plasma apparatus comprises a vessel (1210) defining a channel for containing a gas, a heat sink (1220) adjacent to the vessel, a thermal interface (1230) disposed between and in mechanical communication with the vessel and the heat sink; and an ultraviolet light blocking layer (1234) disposed between the vessel and the thermal interface. The thermal interface (1230) defines a space between the heat sink (1220) and the vessel that accommodates a movement of at least one of the thermal interface, the heat sink, and the vessel in response to thermally induced dimensional changes. The heat sink may have multiple segments urged toward the vessel by a spring-loaded mechanism (1291,1292).
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Inventors:
Holber, William M.
Chen, Shin
Kowe, Andrew Bee.
Besen, Matthew M.
Collins, Jr., Ronald W..
Trulli, Susan Sea.
Xiao, Xiao Chien
Chen, Shin
Kowe, Andrew Bee.
Besen, Matthew M.
Collins, Jr., Ronald W..
Trulli, Susan Sea.
Xiao, Xiao Chien
Application Number:
JP2013084553A
Publication Date:
April 08, 2015
Filing Date:
April 15, 2013
Export Citation:
Assignee:
MKS INSTRUMENTS,INCORPORATED
International Classes:
H05H1/24; H01J37/32
Domestic Patent References:
| JP2002252215A | ||||
| JP2002075690A | ||||
| JP1105190A |
Foreign References:
| WO1999000823A1 |
Attorney, Agent or Firm:
Shinjiro Ono
Yasushi Kobayashi
Hiroyuki Tomita
Osamu Hoshino
Omaki Ayako
Yasushi Kobayashi
Hiroyuki Tomita
Osamu Hoshino
Omaki Ayako