PLASMA PROCESSING SYSTEM AND METHOD FOR FITTING ANNULAR MEMBER

Japanese Patent JP2022148699

A

To appropriately perform positioning of an annular member in fitting the annular member on a substrate support stand using a carrier.SOLUTION: A plasma processing system comprising a plasma processing apparatus and a decompression carrier executes: a step of adjusting a temperature of a substrate support stand to a predetermined temperature; and a step of carrying an annular member above the substrate support stand, receiving the annular member using a lifter whose temperature is adjusted at the temperature, and placing the annular member. The processing apparatus comprises a wafer support base 101 on which a substrate W and an edge ring E, an annular member, are placed. The wafer support base has a plurality of insertion holes 119 and comprises a lifter 107 that rises and lowers so as to protrude from the substrate support stand, a raising and lowering mechanism for raising and lowering the lifter, and a flow path 108 that configures part of a temperature adjustment mechanism for adjusting a temperature of the substrate support stand. The decompression carrier comprises a carrying mechanism for carrying the substrate. A recess E1 is formed on a bottom surface of the substrate support stand. The recess's position agrees with positions of a corresponding lifter and insertion hole.SELECTED DRAWING: Figure 4

JPH098007	METHOD FOR FLATTENING INSULATION FILM
WO/2009/017020	QUARTZ GLASS MEMBER FOR PLASMA ETCHING
JPH01315135	PLASMA ETCHING APPARATUS

MATSUURA SHIN

JP2021050472A

October 06, 2022

March 24, 2021

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TOKYO ELECTRON LTD

H01L21/3065; H01L21/677; H01L21/683; H05H1/46

Kanemoto Tetsuo
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine

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