Title:
PLASMA TREATMENT APPARATUS FOR WORK AND PLASMA TREATMENT METHOD
Document Type and Number:
Japanese Patent JP3664026
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus and method which uses a vacuum suction means as the means for fixing a work of the object of plasma treatment.
SOLUTION: An upper electrode 2 and a lower electrode 3 are provided in a vacuum chamber 1. A suction hole 17 in the lower electrode 3 is evacuated by a first pump 21, and a work is fixed on the lower electrode 3. Then the vacuum chamber 1 is evacuated by a second vacuum pump 26, and a plasma generation gas is supplied to execute plasma treatment, while maintaining the vacuum pressure of the vacuum chamber 1 within a range of plasma treatment pressure. When plasma treatment has finished, the supply of the plasma generation gas is stopped, and first the vacuum chamber 1 should be returned to atmospheric pressure, and secondly, the absorbing hole 17 should is returned to the atmospheric pressure.
Inventors:
Hiroshi Toshi
Kiyoshi Arita
Kiyoshi Arita
Application Number:
JP2000016765A
Publication Date:
June 22, 2005
Filing Date:
January 26, 2000
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05H1/46; C23C16/02; C23F4/00; H01L21/302; H01L21/3065; (IPC1-7): H01L21/3065; H05H1/46
Domestic Patent References:
| JP2000286215A | ||||
| JP9326385A | ||||
| JP4071215A | ||||
| JP57090934A |
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito
Tomoyasu Sakaguchi
Hiroki Naito