PURPOSE: To provide a plate material peeling device for peeling plate material one by one for carrying, which can easily peel the plate material without damaging them and which can sufficiently peel the plate material even in the case of the plate material at a small dimension and of which structure is simplified.

CONSTITUTION: A suspension frame 2 is lowered, and stopped at a height, in which the lower end of a suction cup 4a is separated from the surface of a chip 7a at about t=0.2mm of distance, and in this stop condition, when the air of the suction surface side of the suction cup 4a is sucked through a passage inside of a pipe 3a, negative pressure is generated between the suction cup 4a and the chip 7a, and the suction cup 4a is deformed to the chip 7a side by this negative pressure, and finally, the suction cup 4a sucks the chip 7a. Furthermore, when the suction by this suction device is continued, the suction cup 4a is shrunken so as to return to the original condition, and the chip 7a is peeled from a board 6 by this shrinking force.