Title:
PLATING DEVICE
Document Type and Number:
Japanese Patent JP2935448
Kind Code:
B2
Abstract:
PURPOSE: To enable easy removing of air bubbles on a substrate surface and at a resist opening at the time of plating, that is, airs existing in a plating solution at the early time of plating and gases generated in an electrochemical reaction in a plating device for the substrate.
CONSTITUTION: An opening surface of a cup 2 in which the plating solution 12 flows is positioned downward and a cathode electrode 7 brought into contact with a connecting terminal for plating of the substrate 11 supported with the surface to be plated directed upward is provided at the downward opening surface of the cup 2. Further, a substrate supporting base 1 supporting the substrate 11 with the surface to be plated directed upward while being joinable with and separable from the downward opening surface of the cup 2 is provided. An anode electrode 4 is provided above the substrate 1 in the cup 2 and a plating solution supplying means (a tank 13 and a pump 14) for feeding the plating solution 12 is provided. Further, a substrate attracting means (a suction path 3) attracting the substrate 11 to the surface of the substrate supporting base 1 is provided.
Inventors:
YAMAMOTO MICHIHIKO
Application Number:
JP2625994A
Publication Date:
August 16, 1999
Filing Date:
January 28, 1994
Export Citation:
Assignee:
KASHIO KEISANKI KK
International Classes:
C25D5/08; C25D7/12; C25D17/00; H01L21/321; H01L21/60; H05K3/24; (IPC1-7): C25D7/12; C25D5/08; C25D17/00; H01L21/60
Domestic Patent References:
| JP428897A | ||||
| JP3202488A |
Attorney, Agent or Firm:
Hiroshi Arafune (1 person outside)
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