Title:
めっき装置及びめっき方法
Document Type and Number:
Japanese Patent JP7440571
Kind Code:
B2
Abstract:
A plating apparatus for plating a substrate, the plating apparatus comprising: an anode that is disposed facing the substrate; and an intermediate mask that is disposed on the substrate side between the substrate and the anode, has a first central opening that causes an electrical field from the anode to the substrate to pass therethrough, and has an auxiliary anode disposed around the perimeter of the first central opening in an internal space of the intermediate mask, wherein the area of the auxiliary anode is no more than 1/5 of the area of the anode.
Inventors:
▲高▼橋 直人
Naoki Shimomura
Naoki Shimomura
Application Number:
JP2022097590A
Publication Date:
February 28, 2024
Filing Date:
June 16, 2022
Export Citation:
Assignee:
Ebara Corporation
International Classes:
C25D17/10; C25D21/12
Domestic Patent References:
| JP2021011624A | ||||
| JP2017043815A |
Foreign References:
| KR1020070041227A |
Attorney, Agent or Firm:
Toru Miyamae
Yukio Kanegae
Makoto Watanabe
Tatsumi Ono
Yukio Kanegae
Makoto Watanabe
Tatsumi Ono