To provide a plating equipment efficiently forming a plating layer having uniform thickness on a base material particle having electrical conductivity.

The plating equipment for the base material particle having electrical conductivity includes: a plating bath 11 provided with a plating chamber in which a plating solution is stored; a first surface arranged in a position to be immersed in the plating solution in a state wherein the plating solution is stored in the plating chamber; a second surface arranged to face the first surface in a position to be immersed in the plating solution in the state wherein the plating solution is stored in the plating chamber and relatively movable to the first surface while keeping the positional relation to face the first surface; a gap part which is formed from the first surface and the second surface and in which particle group containing the base material particle are arranged; a cathode which is provided in the gap part; and an anode.