Title:
PLATING DEVICE AND PLATING METHOD
Document Type and Number:
Japanese Patent JP2011080129
Kind Code:
A
Abstract:
To reduce a space where a plating device is arranged in a plating device and a plating method.
A plating device unit 20 is attached on each of the upper surface and the lower surface of a fixed base 31. The fixed base 31 rotates with the rotation of a motor 36. The motor 36 is driven to position each plating device 20 in the upper side to fit a member 51 to be plated. A plating film free from void is formed by plating while rotating the fixed base 31 in one direction and the reverse direction to rock the plating liquid in the plating chamber 18 to eliminate air stuck on the member 51 to be plated.
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Inventors:
ISHIWATARI SHINYA
Application Number:
JP2009234820A
Publication Date:
April 21, 2011
Filing Date:
October 09, 2009
Export Citation:
Assignee:
CASIO COMPUTER CO LTD
International Classes:
C25D19/00; C25D7/12; C25D17/04
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