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Title:
PLATED MATERIAL AND TERMINAL USING PLATED TERMINAL
Document Type and Number:
Japanese Patent JP2017197802
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a plated material capable of suppressing discharge of a corrosion product at relatively low cost and reducing contact resistance.SOLUTION: There is provided a plated material (1) having a ground layer (11) constituted by Ni and an Ag plated layer (12) formed on a base material (10) constituted by Cu or an alloy containing Cu as main raw material in this order with thickness (H1) of the ground layer of 0.1 μm to 1.0 μm and thickness (H2) of the Ag plated layer of 1.0 μm or less.SELECTED DRAWING: Figure 1

Inventors:
ITO YOSHITAKA
Application Number:
JP2016088723A
Publication Date:
November 02, 2017
Filing Date:
April 27, 2016
Export Citation:
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Assignee:
YAZAKI CORP
International Classes:
C25D5/12; C25D7/00; H01R13/03
Domestic Patent References:
JPH10284667A1998-10-23
JP2015126223A2015-07-06
JPS5757885A1982-04-07
Foreign References:
WO2014054817A12014-04-10
Attorney, Agent or Firm:
Hidekazu Miyoshi
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu



 
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