Title:
めっき方法
Document Type and Number:
Japanese Patent JP7398292
Kind Code:
B2
Abstract:
There is provided a method of plating comprising: a process of bringing a sealing portion of a seal provided to prevent a contact of a substrate holder that holds a substrate from coming into contact with a plating solution, into contact with pure water; and a process of detecting a leak of the seal, based on presence or absence of a short circuit of a leak detection electrode placed inside of the substrate holder after the sealing portion is brought into contact with the pure water and before the substrate is brought into contact with a chemical solution.
Inventors:
Shoichiro Ogata
Application Number:
JP2020020793A
Publication Date:
December 14, 2023
Filing Date:
February 10, 2020
Export Citation:
Assignee:
Ebara Corporation
International Classes:
C25D21/12; C25D7/12; C25D17/06; C25D21/00; G01R31/50; H01L21/60; H05K3/18
Domestic Patent References:
| JP2008190044A | ||||
| JP2020002389A | ||||
| JP2019137898A | ||||
| JP2006214009A |
Attorney, Agent or Firm:
Toru Miyamae
Yukio Kanegae
Tatsumi Ono
Makoto Watanabe
Yukio Kanegae
Tatsumi Ono
Makoto Watanabe