Title:
PLATING SOLUTION AND ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JP2009191335
Kind Code:
A
Abstract:
To provide an electrolytic or electroless plating solution which has excellent temporal stability and a wide gloss range, shows uniform plating appearance, can effectively provide an intended coating film composition and contains no cyanide, and to provide electronic parts having a metal film which has been formed by using the same.
The plating solution includes a chemical compound shown by Formula (1) and one or more water-soluble salts of a metal selected from the group consisting of the Group VIII, IB, IIB, IIIA, IVA and VA in the fourth period to the sixth period. The water-soluble salt of the metal in the plating solution is that of tin, silver, gold, platinum, palladium or copper in particular.
Inventors:
NISHIKAWA TETSUJI
SAKAEGAWA MASAHIRO
YOSHIMOTO MASAKAZU
SAKAEGAWA MASAHIRO
YOSHIMOTO MASAKAZU
Application Number:
JP2008035092A
Publication Date:
August 27, 2009
Filing Date:
February 15, 2008
Export Citation:
Assignee:
ISHIHARA CHEMICAL CO LTD
DAIWA FINE CHEMICALS CO LTD LA
DAIWA FINE CHEMICALS CO LTD LA
International Classes:
C25D3/02; C23C18/31; C25D3/32
Domestic Patent References:
| JP2007521390A | 2007-08-02 | |||
| JPS4734129A | ||||
| JPS355621B1 | ||||
| JP2004308006A | 2004-11-04 | |||
| JPS55104493A | 1980-08-09 |
Foreign References:
| US3000800A | 1961-09-19 | |||
| WO2007022075A2 | 2007-02-22 | |||
| WO2007022075A2 | 2007-02-22 | |||
| GB884036B |
Attorney, Agent or Firm:
Yukio Ono
Horikawa Kaori
Horikawa Kaori