Title:
【発明の名称】実装装置
Document Type and Number:
Japanese Patent JP3137250
Kind Code:
B2
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Inventors:
Iwao Ichikawa
Application Number:
JP15274093A
Publication Date:
February 19, 2001
Filing Date:
May 31, 1993
Export Citation:
Assignee:
ソニー株式会社
International Classes:
B25J15/00; H05K13/04; (IPC1-7): H05K13/04
Domestic Patent References:
| JP3110897A | ||||
| JP5796787A | ||||
| JP3157507A | ||||
| JP5235597A | ||||
| JP669686A |
Attorney, Agent or Firm:
Keiki Tanabe