To improve a plug-in connection device having at least three, especially four or more, contact banks so as to permit assembly and contact making on a printed wiring board in a technically simple way, especially without the use of special processes.

Solder terminals of contact elements of at least one contact bank are arranged such that the spacing between the solder terminals of the contact elements of the at least one contact bank and solder terminals of contact elements of the other contact banks is larger than the spacing between the solder terminals of the contact elements within the other contact banks.