Title:
POLAMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3525607
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polyamide resin compsn. improved in moldability, color tone, tensile strength, elongation at break, bending strength, bending modulus, chemical resistance, heat distortion temp., etc.
SOLUTION: This compsn. mainly comprises a copolyamide resin and a filler. The resin has amide bonds (X) which are formed from a 4-14C aliph. diameter is terephathlic acid and of which the ratios of the content observed to that calculated of amide bonds satisfy the relations 0.9≤[XY]obs./[XY]calcd.≤1.1 and 0.9≤[XX]obs./[XX]calcd.≤1.1 (wherein Y is an amide bond other than X; [XY] is a content of adjacent X-Y bonds; calcd. means a value calculated; and obs. means a value observed. The half- crystallization time of the resin satisfies the relation: 4.4-0.1(Tm-1)≤logt1/2≤5.5-0.1(Tm-T) [wherein t1/2 is the half-crystallization time (sec); Tm is the m.p. (°C) of the resin; and T is the temp. (°C) at which t1/2 is measured].
Inventors:
Kominami, Kazuhiko
Sakurai, Takeshi
Kobayashi, Kazuhiko
Sakurai, Takeshi
Kobayashi, Kazuhiko
Application Number:
JP2789096A
Publication Date:
May 10, 2004
Filing Date:
February 15, 1996
Export Citation:
Assignee:
TORAY IND INC
International Classes:
C08G69/26; C08K3/00; C08K7/02; C08L77/00; C08L77/06; (IPC1-7): C08L77/06; C08G69/26; C08K3/00; C08K7/02