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Patent Searching and Data


Title:
POLISHING APPARATUS AND POLISHING HEAD
Document Type and Number:
Japanese Patent JP2007053164
Kind Code:
A
Abstract:

To provide a polishing apparatus capable of preventing unneeded moment from being generated in a chuck and a retainer in polishing work and improving polishing precision to a disc-like workpiece for the polishing apparatus, which has the polishing head that has the chuck and the retainer supported so that they can move vertically freely and can be rocked freely to the head body, a chuck pressurizing means for pressurizing the chuck over the entire surface from an upper part, and a retainer pressurizing means for pressurizing the retainer over the entire surface from an upper part, and to provide the polishing head.

The polishing apparatus has the polishing head that supports the chuck independently of the retainer through a chuck support mechanism against the head body and supports the retainer independently of the chuck through a retainer support mechanism against the head body. The polishing head supports the chuck independently of the retainer through the chuck support mechanism against the head body, and supports the retainer independently of the chuck through the retainer support mechanism against the head body.


Inventors:
MATSUDA TAKEHIKO
TOKUNAGA HIROYUKI
TAKEDA HIDETOSHI
KOBIKI YASUHIRO
YAMADA RYOICHI
Application Number:
JP2005235862A
Publication Date:
March 01, 2007
Filing Date:
August 16, 2005
Export Citation:
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Assignee:
SUMCO TECHXIV CORP
KOMATSU MFG CO LTD
International Classes:
H01L21/304; B24B37/04; B24B37/30
Attorney, Agent or Firm:
Takahisa Kimura
Yoshiyuki Obata