POLISHING BODY, POLISHING DEVICE EQUIPPED THEREWITH, SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME, AND SEMICONDUCTOR DEVICE MANUFACTURED THEREBY

Title:

POLISHING BODY, POLISHING DEVICE EQUIPPED THEREWITH, SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME, AND SEMICONDUCTOR DEVICE MANUFACTURED THEREBY

Document Type and Number:

Japanese Patent JP2004074314

Kind Code:

A

Abstract:

To meet requirement for elimination of steps and uniformity imposed on a workpiece with sufficient accuracy, and at the same time to improve a yield to a large extent by reducing edge exclusion to a possible narrow range.

In this polishing body 40 comprising a hard material layer 41, a soft material layer 42, and a plate member 43 interposed between the hard material layer 41 and soft material layer 42 and jointed to both the material layers 41, 42, many concentric arced slits 43a centering around a predetermined point A are arranged in the plate member 43. Thereby, the radial flexible stiffness of the plate member 43 centering around the predetermined point A becomes smaller than the flexible stiffness in the peripheral direction of the plate member 43 centering around the predetermined point A.

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Inventors:

SUGAYA ISAO
UDA YUTAKA
HAYASHI YUTAKA

Application Number:

JP2002234969A

Publication Date:

March 11, 2004

Filing Date:

August 12, 2002

Export Citation:

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Assignee:

NIKON CORP

International Classes:

B24B37/20; B24B37/22; B24B37/26; H01L21/304; (IPC1-7): B24B37/00; H01L21/304

Attorney, Agent or Firm:

Masago Onishi

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